I see a variety of similarities between Tin whiskers… and my own: Elusive, thin, short, and never helpful.  And there is always the random single hair that frustrates you to no end.

Unfortunately, the costs associated with tin whiskers in the electronics, defense, health, and aerospace industries are astronomical compared to my need to shave once every two weeks.  Failure of products due to tin whisker growth can undermine an entire mission, scrap a program, or take a life.  I think about electronic pacemakers, our men and women traveling to space, or our servicemen and women flying at Mach speeds thousands of feet above the ground.

There has yet to be a definitive ruling made concerning the cause/prevention of whiskers, although pure tin components and plating seem to exhibit the highest likelihood of developing them.  Best practices at this time are to use a tin/lead mix with no greater than 97% tin.  However, RoHS regulations are throwing a wrench into this with its demands for lead-free products.  Some RoHS frequently asked questions are answered here.

This issue received significant attention at the IPC Technology Interchange this last December.  Also, the Center for Advanced Life Cycle Engineering at the University of Maryland (CALCE) and The Institute of Scientific and Industrial Research at Osaka University (ISIR) are putting on another International Symposium on Tin Whiskers this June.  The call for papers is still out.  Read more about this at PCB007. Proceedings from past Symposiums can be found here.

For a great overview of tin whiskers, be sure to check out the resources provided by NASA.  The pictures in this article have all been sourced from NASA.

Have you dealt with tin whiskers in your products/designs? What types of damage have they caused?  What are some of the things you have done to diminish the likelihood of them?

Homepage Image Original found here

I have spent some time exploring the virtual show floor and various exhibits.  My gut response? I miss shaking hands.

A virtual trade show has some great benefits.  The reduced costs associated with travel is the first to come to mind.  There is also the advantage of being able to go about your day at work, and to hear a notification that someone has stepped into your “booth”.

However, my first interaction with a virtual show hasn’t been the best.  Please do not read that as a condemnation of virtual shows.  I just don’t fit the description of someone who would truly benefit from this show.  It seems that this style of show (virtual) really weeds out the moochers.  What I mean is – there are a few very specific strengths of the show, and if you fit within the target of those strengths, it will be great.  However, if you’re on the fence, you won’t like it.

With 2,300 attendees, Virtual PCB has been great for the exhibitors.  Many have stated that their booths have been consistently busy.  And it would be awesome to be an attendee looking for some services provided by the exhibitors.  The ability to switch in between various companies and instantly chat with them is great.  Exhibitors also have access to attendee lists, which is a very valuable resource when used correctly.

But for me, as a competitor to most of the exhibitors and being a marketing guy without technical expertise, there was not a whole lot of benefit.  Had we exhibited, I might be singing a different song.  This is a great benefit for the exhibitors… having a firewall/deterrant of sorts to their competitors.  There is very little cherry-picking.

What are your thoughts or experiences concerning virtual shows?  They are definitely a piece of the puzzle as it relates to the future of our industry.  UP Media is leading the charge, and sincerely I commend them.  Did you find the show helpful?  Are there aspects you wish were different?

There was a particular moment, however, which really encouraged me and provided some hope for 2010. A group of designers and engineers we’ve been working with for a few years now came down to say hello and to ask us some questions. It was great to have dynamic dialogue and interest in our company’s various developments over the last two years. It was within that conversation that I watched a younger engineer bridge the gap between fabricator and designer. And no exaggeration, it was like the room got brighter and the air sweeter.

Spending the last year getting to know both groups has exposed me to the complaints on both sides of the fence. I have heard frustrations from designers and customers concerning quality, timeliness, and customer service. I have seen fabricators scratch their head and stare at design files or bills of material in wonder and confusion. And finally someone stepped up and asked the most beautiful question. I will paraphrase, but I remember it pretty well.

He said, “Morgan, is there anything we can be doing to make your job easier? I mean, I honestly don’t know a whole lot about the details of the fabrication process… I just design them. What could we be doing to help you?”

Every relationship is different, and every customer is different, but it is essential to open up the discussion about how we can form a more seamless relationship between design, fabrication and assembly.  And so I would like to open up the discussion about how fabricators can better serve their customers, and vice versa.  Keep it clean, keep it helpful, and keep it coming.

- Liam

BANNOCKBURN, Ill., USA, February 4, 2010 — Complacency with having survived the trials of 2009 is a naïve posture that, in 2010, will lead to continued struggles warns Walt Custer. The noted industry analyst and president of Custer Consulting Group will join IPC Director of Market Research Sharon Starr for the “Global Business Outlook: Where Do We Go Next?” keynote session at IPC APEX EXPO on Wednesday, April 7 in Las Vegas.

“If a company hasn’t been planning for the recovery,” Custer says, “it has considerable catching up to do or it will risk losing market position.” Custer will share his insights into the leading global indicators he tracks to help companies understand timing sensitivities for phasing in recovery plans.

Custer and Starr will provide forecasts and trends for electronics equipment and component markets and discuss how seasonal and cyclical trends affect the industry and the supply chain.

Starr will present the findings of the latest IPC market research and explain how companies can use this data to assess their own performance and identify promising markets. IPC’s market research studies show the latest trends in demand, production and industry-specific benchmarks for the PCB, EMS, process consumables, solder, assembly equipment and laminate industries.

In addition, Starr will preview a new series of industry market forecasts at IPC APEX EXPO. Focused on specific industry segments and product categories within the industries IPC serves, new forecasts are in development now for the materials and equipment, PCB, EMS and select OEM industry markets.

“It’s exciting to be able to offer this type of new data to the industry,” said Starr. As she explains, keeping track of economic indicators and specific market data can help companies be more nimble and competitive. She adds, “Any company, regardless of size, can create competitive advantages by watching the indicators and planning appropriately.”

The Global Business Outlook keynote session is free to all registrants of IPC APEX EXPO 2010. The world’s premier technical conference and exhibition for printed board design and manufacturing, electronics assembly and test, IPC APEX EXPO will take place at the Mandalay Bay Resort & Convention Center in Las Vegas, April 6–9, 2010. For more information, visit www.IPCAPEXEXPO.org.

# # #

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

I have spoken with several individuals in the last few weeks who hold high expectations, and look to DesignCon as being the most valuable show of the year.  Although that is personal opinion, I can easily see why those sentiments have been shared.

If you’re in the area, be sure to register and attend the show.  You can buy your various passes here.

Also, be sure to follow @DesignCon2010 on twitter.

Blackjack II

As the keys begin to stick on my Samsung Blackjack II, and I think about how the navigation wheel used to spin freely, I remember the days of my Siemens M56.  That little phone was built like a tiny brick, and it withstood the harshest abuse.  Whether we were swimming in saltwater or it was falling off the top of my moving car, my little phone never complained, remained tough, and always worked.  It was a sad day when, after three and a half years, I had to “upgrade” to a Motorola Razr.

M56

While the M56 was tough, it was never tested or designed as a “rugged” device.  I was very fortunate it survived, but for those whose lives rely upon the dependability of their electronics, chance does not satisfy.  Many manufacturers have recognized the need for electronics able to withstand the harshest of environments, and have designed “rugged” products for use in situations as diverse as the battle field to deep freezers.

But how rugged is the “rugged” classification?  Please comment below if you feel that I am far off…

What I have found has not surprised me.  It seems that just as I can tell you I am really strong; unless you ask me how much I can bench-press, you really have no idea how true my claims of strength are.  And even if I tell you how much I can lift, you are not sure if I am telling the truth.  The same seems true for the classification of “rugged” within the electronics industry.  Many have self-certified their products as rugged, or have developed internal testing procedures under which they qualify their products.  So how do you know what you are getting, and how do you know which rugged product to buy?  Let’s dig further.

The very first step you should complete is to determine exactly in what environment your product will be operating.  Some of the various standards/tests include: low pressure altitude testing, high and low temperatures, rain (freezing and penetrating), various forms of shock (both while in operation and while off), humidity, growths (fungus, algae, rust), sand and dust, accelerations, explosions, and various types of vibration.  As you can imagine, every product will meet different standard within each of these categories.  And while phone A may be “rugged” when it relates to salt-water, phone B may be “rugged” as it relates to extreme temperatures.

Fortunately there are various standards in place for the testing of products as it relates to rugged use.  The MIL-STD-810 (Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests) is a 500+ page document
(open at your own risk, it’s big) outlining the chamber test methods necessary to use when certifying a product to be rugged in a particular application for military use.  This standard can be tailored for commercial use, and many products advertise that they meet MIL-STD-810 standards in various settings.  For example, you will notice that the Olympus Stylus-Tough 8000 is MIL-STD-810 certified to certain levels as it relates to shock and temperature.  But just because it’s rated as rugged does not mean you should take it onto the water slide (although in this case you can… see the video on this page).

Some companies certify themselves to the MIL-STD-810 standards, while others use outside auditing organizations to confirm their claims.  If it were me, I would always require an external auditing organization to confirm the claims made (especially if the product is protecting the life of someone).  Some companies have developed and branded their own systems of rugged classification.  For instance, Sonim cell phones adhere to the “Rugged Performance Standards” set in place by Sonim.  Take a look at the video.  It is pretty neat. Though again, always make sure that an outside agency has substantiated the claims made by the manufacturer.

So just as I will tell you that I am very strong, and you would ask me to qualify my statements; so too should you always seek to qualify the statements made in regards to the rugged nature of various electronics.  What do you need it to withstand?  What standards does it claim to adhere to?  Have those claims been substantiated by an outside agent?

Enjoy!

The year 2009 has been an intense crash-course and immersion into the PCB industry.  I entered the field having only seen a board in settings such as when my mother’s blender lay torn apart on my lap as I sought to “fix” it as a ten-year-old.  My background is in entrepreneurship and business development.  Keep these things in mind as you read, but I hope that you do not allow them to lessen the various observations.  Please be sure to comment, critique, and add to this article in the comments section.

Market Segments
Tradeshows
There is nothing as bittersweet as a tradeshow.  It is easy to see that while many I’ve spoken with claim to dread the show circuit, there is an industry sustaining vibrancy found on the tradeshow floor.  In fact, regardless of size, shows remind many that they are not alone in this economic climate and in this industry.  “How about them Yankees” was definitely replaced by depressed and rehearsed comments about overseas production and its implications.  Yet even competitors can console one another.

Recessions inherently bring about budget cuts and a careful critique of the ROI (return on investment) of all marketing endeavors including tradeshows.  Smaller displays with fewer freebies seemed more prominent as the year progressed.

However, tradeshows will never go away because there is an inherent need within any industry to foster community and to provide convenient platforms for vendors and customers to interact.  Yet there is a great need for training and planning of employees to occur in 2010.  Pre and post-event networking skills need to be developed.  And it seems clear that the question of whether we will attend the next tradeshow is moot until we have exhausted an investigation of how we can best take advantage of the opportunity contained within each show.

Media and Trade Publications
As a complete rookie to PCB’s, I found the press to be my greatest ally.  Wonderful individuals within UP Media and  iConnect007 greatly encouraged and guided me through year one.  In fact, they are both the customer and supplier’s greatest asset.  Many of the most knowledgeable individuals are connected with these organizations and an email to either requesting direction or a good contact will usually turn out well.  Don’t expect them to play favorites or violate privacy issues, but they will do their best to direct you toward professionals or resources which will aid you greatly.

Political Climate
Changing the political landscape concerning any issue is always a laborious and time consuming process.  However, great strides were taken this year as the position of PCB Executive Agent was created.  In the second week of December, close to one hundred twenty-five industry professionals gathered in Washington D.C. to discuss how we can meet the needs of the Department of Defense in the future.  It was great to see so many key organizations represented and to see that many CEO’s and owners attended personally.  If there is to be a single word that must define 2010, it will be collaboration.  The IPC Technology Interchange in Washington was a great step toward that end.  I will discuss collaboration in greater depth shortly.

Customers
Throughout the year I sensed a continual increase in both the loyalty and price consciousness of our customers.  It was great to see the loyalty exhibited by many of our best customers, while it was tough to see quotes lost on price: even a few dollars.  Budget cuts have made it hard for everyone, and it is understandable in most cases why these occurred.

Although the following recommendation is applicable to every year within a business, I feel 2010 demands an even greater attempt.  It is clear that better communication and collaboration could and should occur between customers and the design, fabrication and assembly providers.  My hope is to personally continue to search out ways we can better serve our customers  (based on what they say, not what we assume).  This is crucial; especially for the small domestic board shops and assemblers.

Praises and Hopes
I have seen several people step up and push the envelope this year.  Some have exhibited customer service above and beyond expectations, some have embarked on innovative marketing and sales endeavors, and several faces have gained recognition as they position themselves as experts within their niche.  Below are some of the ways that they have accomplished these things.

Online Resources
Those who have met me this year most likely know about my passion for seeing the industry catch up with the rest of the private sector in regards to leveraging the tools and resources available online.  There is much to be done, but I am pleased with the small steps taken this year.  The year 2009 exhibited an increased number of companies transitioning to online marketing and advertising.  Several new columnists have appeared for various media organizations and the concept of blogging is beginning to make sense to some.

I continually experience excitement over our endeavors to develop an industry blog, yet see little follow through.  Although much of that may be due to the quality of my efforts, I do hope to see increased support and contribution in the coming year for HotPCB and my colleagues who are pouring their energies into online media.

I was given the opportunity to speak at UP Media’s PCB Atlanta in October on the subject of how the PCB industry can effectively leverage the various Web 2.0 tools currently available.  Those in attendance seemed to find it helpful, and it was a great first step.  I challenge both individuals and organizations to sit down and evaluate how they can implement these tools into their various marketing and sales strategies.

Federal Programs
This year’s Federal Matchmaking event in Tarrytown, NY was extremely well attended.  I highly admire the SBLO’s and various individuals who spend their time making sure that small-business allocated opportunities are distributed.

The PTAC officers and employees really stepped up and it was very apparent how much they desire to foster commerce between small/disadvantaged businesses and the government.

Education
There is a huge need for education within the industry.  And yet, providing resources to seasoned veteran is far from enough.  Unfortunately, the industry is graying, and there is no clear next generation.  Some have recognized the massive vacuum that is forming and are investigating the feasibility of teaching electronics at the high-school level.  This is a movement still in its infancy and needs a lot of support, guidance, materials, and commitment.  That is where collaboration will truly show its worth.

Collaboration
As promised, I want to briefly touch on collaboration once again.  It has been said that when everyone is responsible, no one is responsible.  I saw a lot of great concepts discussed at the Technology Interchange.  There has been a lot of hard work on the part of various individuals.  We as an industry need to be very careful that we don’t simply sit back and applaud their work.  A concerted effort should be made by all.

Change is a slow process.  But it is even slower when there are only a few players.  My hope is that 2010 will be a year marked with collaboration, unity, and change.  We have all seen glimpses of where things could go.  And although it is unlikely that things will ever look like they did twenty years ago, I find it highly likely that this industry will take huge leaps forward in the next twelve months.

In ending, I am very thankful for where I am, and where we are.  Great hopes drive my endeavors and will continue to shape my efforts.  Where do you see yourself making a difference?  What unique skills can you bring to the table?  How can we come together to overcome the various challenges that are facing our industry?

2010, here we come.

U.S. Consulates Help IPC APEX EXPO Exhibitors Reach Across Oceans and Borders to Develop Business and Partnerships

BANNOCKBURN, Ill., USA, December 18, 2009 — The U.S. Department of Commerce has chosen IPC APEX EXPO^TM as one of a select group of U.S. trade shows to participate in its International Buyer Program (IBP) for 2010. The event, produced by IPC — Association Connecting Electronics Industries®, was chosen by a vote of U.S. embassies, consulates and commercial centers worldwide. One measure was the show’s appeal to overseas visitors. In 2009, 15 percent of attendees came from 42 countries other than the United States.

“We’re pleased to be able to provide this exclusive opportunity to our exhibitors to help them expand their businesses globally,” says Kim Sterling, IPC vice president of marketing & communications. As one of only 36 U.S. trade shows in the IBP, IPC APEX EXPO has secured support from Commercial Service officers around the world who will reach out to their local regions to recruit qualified buyers, sales representatives and business partners to the event.

Country and industry experts from the U.S. Commercial Service will be on-site during IPC APEX EXPO to help companies with hands-on export counseling, marketing analysis and matchmaking services. In addition to the increased global promotion of the event, a special Export Interest Guide will be provided to all international attendees to give them an easy way to identify IPC APEX EXPO exhibitors who are interested in exporting to specific international markets.

Only IPC APEX EXPO 2010 exhibitors may participate in the IBP as suppliers. Information is available at www.IPCAPEXEXPO.org/IBP for current exhibitors. Companies that are interested in exhibiting should contact IPC Director of Trade Show Sales Mary Mac Kinnon at +1 847-597-2886 or MaryMacKinnon@ipc.org.

For more information on IPC APEX EXPO, visit www.IPCAPEXEXPO.org. Individuals who are interested in visiting the show as part of an international delegation should contact their local U.S. commercial specialist, embassy or consulate. Links to local consulates as well as information on obtaining visas, translated in eight languages, is available at www.IPCAPEXEXPO.org/international.

# # #

About IPC

IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

Contact:

Anna Garrido, IPC Director of Marketing and Communications
+1 847-597-2804
AnnaGarrido@ipc.org

This is a complex question with a large number of factors.  One focus of the discussion could be on the pure technical limitations which will be reached according to the laws of physics, or you may consider the unlikelihood that we will ever meet a need that PCB’s can’t handle due to the high costs which would surround that new technology.

I hope to hear your input and comments.  Where do you see the technology going and needing to innovate?  How do you see system-in-a-package and 3D Integration being a factor?  I don’t even have all of the appropriate questions surrounding this topic, but I hope that the comments below will be full of insight and discussion.

Thanks!!

P.S. Someone should add to the wikipedia article about system-in-a-package.  It could use some help.