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Our Fabrication Team Specializes In:
1 - 5 Day Turn / 2 - 20 Layers
Blind & Buried Vias
RF / Hybrid / Microwave
Rigid-Flex Up To 30 Layers
Multilayer Up To 30 Layers
2 Mil Trace Width
Sequential / Lamination
FR-4 / 408 / IS410
Standard Lead Times
Flex Circuits:
1 - 2 Layers: 1 Day To 5 Days
3 - 6 Layers: 3 Days To 5 Days
8 - 30 Layers: 7 Days And Up
Rigid-Flex Circuits:
1 - 6 Layers: 3 Days To 5 Days
8 - 30 Layers: 7 Days And Up
FR-4 / 408 / RoHS:
1 -10 Layers: 1 Day - 2 Weeks
12-30 Layers: 2 Days - 2 Weeks
Hybrid / Teflon:
1 Day - 2 Weeks
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© 2008 Cirexx International Inc. All Rights Reserved
791 Nuttman Street Santa Clara, CA 95054 United States
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1 800 444 6817 •
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408 988 4534 •
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sales@hotpcb.com