RF / Microwave - Hybrid (Rogers Microwave Materials)

Overview

RF/Microwave - Hybrid PCB Rogers Corporation Microwave Materials Division has an extensive selection of materials most widely used in the commercial communications market.

Greatest advantages are having X, Y and Z CTE matched to copper in addition to very low CTEr. Both properties allow the material to be extremely stable in high temperature environments and up to 40 GHz in analog applications. This material also blends well with FR-4 and other substrates to make dependable hybrid constructions.

RF / Microwave - Hybrid PCB (Rogers Materials) RO4350® high frequency circuit material is UL rated (94V0) and thermal conductivity is much higher than FR-4 joined with a low stable Er and Loss Tangent. Layer-to-Layer Thickness Control is equal to +/- .001, great for Multilayer Construction, including hybrids with other laminates.

Features

- CTEr= +40(4003) / +50(4350)ppm per °C (Low). Tg is 280°C
- ER = 3.38(4003) / 3.48 94350 at 10.0 GHz
- ER is constant to 40.0 GHz
- CTEr = +40(4003) / +50(4350)PPM per °C (Low). TG is 280°C
- ED Copper Only
- Layer-To-Layer Thickness Control = +/- 0.001
- Laminate Cost = $9.50 per square ft.
- Fabrication Costs = Normal To Slightly Increased