Overview
 As you race to create products that are faster, smaller, with more features and more reliable, your designs struggle to do more with less space.
One such development is the Micro Via hole that connects an outer layer of a printed circuit board to the nearest inner layer. Due to the small diameter of both microvias and the pads to which they connect, designers are able to increase circuit density, thus making better use of available "Real Estate". This could, in turn, lead to reduced size, weight, and cost of electronic products.
As Micro Via Technology develops, Cirexx International is committed to working with various methods of microvia formation, seeking the optimal approach for a given situation. Current microvia formation options include controlled depth drilling and laser.
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