Increased Micro Vias Demand
 Continued growth of the global economy, and the seemingly insatiable consumer appetite for smaller, faster, more portable electronic devices such as mobile phones, camcorders, notebook computers, and personal digital assistants, continue to fuel worldwide electronic equipment manufacturing and resulted in an increased demand for microvias.
 As you race to create products that are faster, smaller, with more features and more reliable, your designs struggle to do more with less space.
One such development is the Micro Via hole that connects an outer layer of a printed circuit board to the nearest inner layer. Due to the small diameter of both microvias and the pads to which they connect, designers are able to increase circuit density, thus making better use of available "Real Estate". This could, in turn, lead to reduced size, weight, and cost of electronic products.
As the demand for Micro Via Technology develops due to explosive consumer demand for miniature electronic device, Cirexx International is committed to working with various methods of microvia formation, seeking the optimal approach for a given situation. Current microvia formation options include controlled depth drilling and laser.
Drilling Micro Vias Multilayer PCB technology requires reliable and economic production technology for through and blind holes to establish an electrical connection between the various layers of the multilayer. High density nterconnects (HDI) in particular are currently characterised by connecting holes with diameters down to 50 µm. Holes larger than 200 µm will continue to be created mechanically as before. Laser processing is an efficient technology for theseries production of microvias with diameters
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