Cirexx International PWB PRODUCIBILITY GUIDELINES
FABRICATION DRAWING FEATURES - ALL PWB'S
No. Feature Variable Standard Producibility Reduced Producibility Notes
1 Materials  [1] Standard and High Tg Fr-4 laminates. High performance laminates. Flexible circuit substrates. Ceramic substrates. Teflon substrates.  N/A Isola, Park electrochemical, Arlon, NanYa, DuPont, Rogers, Taconic, W.L. Gore, Espanex, Shin-Etsu  and Hanwha.
2 Maximum layer count for Flex   10 16  
3 Maximum layer count for rigid   22 40 <  
4 Maximum layer count for rigid-flex   16 22  
5  Allowable Tolerance for Layer to Layer Registration.    .008 .005  
6 IPC Classification   1 & 2 3  
7 Minimum Trace Width   .002 .0015  
8 Minimum Air Gap   0.003 0.002  
9 Minimum drill size (mechanical)   .006 .004  
10 Minimum drill size (Laser)   .004 .003  
11 Plated Hole Size Tolerance   Plus or Minus .003 Plus or Minus .002  
12 Sequential Lamination cycles   [2] 4 5  
13 Copper Weight (Base & plated)   0.25 oz - 2.0 oz 0.125 oz - 6.0 oz  
14 Maximum panel size   18 x 24 21 x 24  
15 Maximum Thickness   .150 .180  
16 Thickness Tolerance   Plus or Minus 10 Percent Plus or Minus 5 Percent  
17 Maximum Aspect Ratio   10 to 1 14 to 1  
18 Blind & Buried Vias  [3] Yes Yes Filled and Non-Filled.
19 Stacked Vias  [4] Yes Yes Filled and Non-Filled.
20 Conductive Via Fill  [5] Yes Yes DuPont
21 Non-Conductive via Fill  [6] Yes Yes Tayio
22 Counter sink / Bore  [7] Yes Yes  
23 Scoring   Yes Yes  
24 Routing   Mechanical Laser  
25 Routing Tolerances   Plus or Minus .005 Plus or Minus .003  
26 Inside Radius   .015 .010  
27 Minimum Slot Width   .030 NPT .015 NPT  
28 Minimum Slot Width  [8] .020 plated .010 plated  
29 Drill Positioning   Plus or Minus .002 Plus or minus .0015  
30 Plated Edges   Yes NO  
31 Surface Finish  [9] Hard and Soft Gold, ENIG, Immersion TinH.A.L. Lead Free, H.A.L. 60/40, Immersion Silver, OSP. NO Rohm and Haas, OMG, Enthone.
32 Plated Radii (Castellation)   Yes NO  
33 Plated Milling/Cutouts   Yes NO  
34 Controlled Impedance Single Ended  [10] Plus or Minus 10 Percent Plus or minus 5 percent  
35 Controlled Impedance Differential  [11] Plus or Minus 10 Percent Plus or minus 7 percent If design allows. 
36 Time Delay Reflectometry testing   Yes No Polar CIT S500s
37 Automatic Optical Inspection  [12] Yes No Camtek Orion 3G-S Reflective.
38 Electrical Test  [13] Yes NO A.T.G.s
39 Probe Pitch   .008 / .008 .004 / .004  
40 Probe Accuracy   Plus or Minus .00059 N/A  
41 Repetition Accuracy   Plus or Minus .00039 N/A  
42 Test Current   .01 mA - 30 mA N/A  
41 Test Voltage   4v (field measuring) - 500v (high voltage test) N/A  
42 Threshold Opens test   1 Ohm - 1 kOhm N/A  
43 Threshold Shorts test   500 kOhms -10 MOhms    (field measuring) 500 kOhms -100 Mohms       (high voltage test)  
 
FABRICATION DRAWING FEATURES - FLEX PWB'S ONLY
No. Feature Variables Standard Producibility Reduced Producibility Notes
44 Book Binder  [14] N/A > .75'' Assumes No Bonded Flex Layers.
45 Crossing Flex Legs   N/A If Present  
46 Double Sided Core Cap (1-2) Construction.  [15] N/A If Present  
   
ARTWORK (GERBER DATA) FEATURES - ALL PWB'S
No. Feature Variables Standard Producibility Reduced Producibility Notes
49 Minimum Trace Width & Air Gap on .25 oz Cu.   .002 / .003 .0015 / .002 Nominal Dimensions before Etch Compensation.
50 Minimum Trace Width & Air Gap on .5 oz Cu.   .003 / .004 .002 / .003 Nominal Dimensions before Etch Compensation.
51 Minimum Trace Width & Air Gap on 1.0 oz Cu.   .004 / .005 .003 / .004 Nominal Dimensions before Etch Compensation.
52 Minimum Trace Width & Air Gap on 2.0 oz Cu.   .005 / .008 .004 / .007 Nominal Dimensions before Etch Compensation.
53 Trace Tolerance   Plus or Minus .001 Plus or Minus .0008  
54 Minimum Pad size for Mil-Spec Annular ring   [ .005 External / .001 Internal ]   Drill Size + .014 Drill Size + .010 Assumes Finished Hole size is drilled minus .005 mils
55 Minimum Pad size for IPC  Annular ring            [ .002 External / .001 Internal ]   Drill Size + .012 Drill Size + .008 Assumes Finished Hole size is drilled minus .005 mils
56 Minimum Distance for Conductor to P.T.H.   .010 .007 Applies to Padless Holes
57 Minimum Distance     for Ground Plane Clearance   .015 Clearance .010 Clearance The Clearance around the Pads.
58 Minimum Distance for Hole to the Part Edge.   .030 .020 The Edge of the Hole to the Edge of the Part.
59 Minimum Distance for Art Work Feature to the Part Edge.   .010 .005 The Edge of the Feature to the Edge of the Part.
60 Minimum Dams or Webs for L.P.I. Solder Mask   .005 .003  
61 Minimum Solder Mask Clearance around Features.   .005 per side .002 per side Nominal Dimensions before Etch Compensation
   
    ARTWORK (GERBER DATA) FEATURES - FLEX PWB'S ONLY      
No. Feature Variables Standard Producibility Reduced Producibility Notes  
62 Minimum Distance from Plated Hole          to R/F Interface.   < .075 < .050 The Edge of the Hole to the Edge of the Rigid Board.
63 Minimum Clearance around Cover Coated Pads.  [16] Clearance Diameter < .020 over Pad Diameter. Clearance Diameter < .010 over Pad Diameter. For Up to .003 mils Adhesive; To Allow for Adhesive Squeeze Out & Cover Coat registration.
[1]
Copper weight and substrate thickness. Availability and factory lead times.
[2]
The Thermal properties
of materials. i.e. Tg, Td, TGA, T-260 and T-288.
[3]
Depends on the complexity, Number of Vias and Number of Layers.
[4]
Depends on the complexity, Number of Vias and Number of Layers.
[5]
Depends on the complexity, Number of Vias and Number of Layers.
[6]
Depends on the complexity, Number of Vias and Number of Layers.
[7]
Depends on the Number of Counter sinks and or Counter bores. Also depends on tight tolerances.
[8]

Depends on thickness
[9]
Type, Thickness and Selective.
[10]
Tolerances
[11]
Tolerances
[12]
Quantity: Three.
Reflective Technology
[13]
Everett Charles Testers
Three A2s and one A4
[14]
Book Binder Height
[15]
Base Material: Acrylic "LF" verses Adhesivless "AP"
[16]
Adhesive Thickness