AGC Multi Materials

AGC Multi Materials brings together two long-trusted names in circuit board materials, Nelco and Taconic, under one manufacturer. AGC acquired both copper-clad laminate businesses in 2019.
The combined line pairs more than 85 years of Nelco’s thermal and mechanical expertise with Taconic’s leadership in PTFE-based microwave and RF composites, so designers have one source for laminates and prepregs across high-speed digital, RF, and microwave applications.

Materials & Applications

All AGC materials are RoHS compliant, and many provide high thermal reliability and conductive anodic filament (CAF) resistance for lead-free assembly compatibility. AGC develops and manufactures a full range of RF and digital materials, including thermoset and thermoplastic copper-clad laminates and prepreg/bond ply substrates, which provide high reliability and superior thermal, mechanical, and electrical performance.
AGC materials are designed for high layer count PCBs and demanding RF, microwave, and high-speed digital applications, such as:

• Lead-free assemblies

• High speed / low loss and fine-line multilayers
• Backplanes
• Communications and networking equipment
• Wireless handsets and infrastructure
• Antenna and base station systems
• Power amplifiers, combiners, filters, and splitters
• Automotive radar and driver-assistance systems
• Military guidance, radar, and telemetry
• Satellite and aerospace systems

Materials

The Meteorwave and N-series laminates come from the former Nelco line; the RF, TLX/TLY, fastRise, and specialty materials come from the former Taconic line.