Buried Capacitance

Buried capacitance technology can increase the performance of printed circuit boards via improved signal integrity. This process incorporates a very thin dielectric layer that provides distributive decoupling capacitance.

• Improved EMI, reliability and manufacturability through glass reinforcement and specialty resins for film-based versions.
• Improved power distribution.
• Reduction of high frequency, discrete bypass capacitors, of undesired discrete capacitor resonance.
• Lower plane inductance at high frequencies.

Download Additional Information: PCB Fabrication