Buried Capacitance

A flexible printed circuit board with buried capacitance
Buried capacitance technology can increase the performance of printed circuit boards via improved signal integrity. This process incorporates a very thin dielectric layer that provides distributive decoupling capacitance.

  • Improved EMI, reliability and manufacturability through glass reinforcement and specialty resins for film-based versions.
  • Improved power distribution.
  • Reduction of high frequency, discrete bypass capacitors, of undesired discrete capacitor resonance.
  • Lower plane inductance at high frequencies.

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