Wire Bonding

Cirexx performs Gold and Aluminum wire/wedge bonding utilizing the latest automatic equipment from K & S and ASM. Wire diameters range from 0.7 mil (18µm) to 2.0 mils (50.8µm) for gold wire and from 0.7 mil (18µm) to 1.0 mils (25µm) for aluminum wire with bond pad pitch down to 35 microns.
Cirexx also offers Aluminum wedge bonding with 0.8 mil – 2.0milwire, and can even combine Gold wire and Ribbon bonding in thesame device.

Gold (Au)Ball Bonding 18µm (0.7mil) – 76µm (3.0mil) diameter wire. Pitch down from 35µm.
Aluminum (Al)Wedge Bonding 20µm (0.8mil) – 51µm (2.0mil) diameter wire. Pitch down to 60µm.
Ribbon BondingAu and Al 25µm (1.0mil) X 250µm (9.8mil) ribbon.

Consult factory for additional sizes.

Standard and ultra-fine pitch devices are easily accommodated,producing bonded parts in open cavity plastic or ceramic packages. Cirexx specializes in wire bonding advanced assembly components, including chip on board (COB), chip on flex, stacked or multiple die, and MEMS devices.

Cirexx can accommodate multiple bonding variations and encapsulation options within a single project, providing the flexibility to test different options for your new products.

Cirexx enhances bonding capabilities

Cirexx has enhanced its Flip Chip bonding capability by installing a SEC Flip Chip bonder. The
bonder is capable of placing bumped devices within +/- 2µm placement accuracy. Applications include flip chip, 3-D packaging, MEMS, chip to wafer packaging, optoelectronic and micro optics bonding and assembly, sensors, chip on glass/chip on flex and more.

In addition Cirexx has also added to our Wire Bonder line by purchasing a Hesse & Knipps Automatic Ultrasonic Aluminum Wedge bonder. The bonder is capable of supporting 0.8 to 2 mil wire diameters at bonding speeds of 8 wires/second.

To complete your devices and assist in identification, molded packages can be pad-print marked with a logo, part number and date code, as space allows.

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