Copper-clad laminates & dielectric prepegs.
High performance laminate and prepreg materials
Polyimide flexible foil substrate.
Step changes in wired & wireless communications circuits.
Advanced engineered composite materials.
Thin film deposition on flexible materials and more.
Optimum materials for next gen technologies.
Superior thermal & mechanical performance.
ROHACELL® HF – negligible absorption in the high frequency range
Hanwha Flexible Copper Clad Laminate, core in a flex circuit construction
Professional Manufacturer in Copper Clad Laminates
Low DK with better stability than PTFE’s
Thin-film embedded resistor copper foil
Thermal via fill
OhmegaPly Material for Buried resistors