Materials

Material selection and integration is an essential facet of printed wiring board fabrication. Our expertise regarding advanced material types and combinations allows us to offer our customers a cost-effective solution for almost any design challenge. From high signal integrity to superior dimensional stability, trust Cirexx to make the optimal recommendation for every packaging challenge.

Isola

Copper-clad laminates & dielectric prepegs.

Arlon

High performance laminate and prepreg materials

ThinFlex

Polyimide flexible foil substrate.

Rogers

Step changes in wired & wireless communications circuits.


Taconic

Advanced engineered composite materials.

Sheldahl

Thin film deposition on flexible materials and more.

Dupont

The broadest array of electronic materials for flexible & rigid-flex circuits. Trending nowDupont-HT

Panasonic

Optimum materials for next gen technologies.


Nelco

Superior thermal & mechanical performance.

Evonik

ROHACELL® HF – negligible absorption in the high frequency range

Hanwha

Hanwha Flexible Copper Clad Laminate, core in a flex circuit construction

Ventec

Professional Manufacturer in Copper Clad Laminates


Megtron

Low DK with better stability than PTFE’s

Ticer

Thin-film embedded resistor copper foil

Tatsuta

Thermal via fill

Ohmega

OhmegaPly Material for Buried resistors

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