Materials
Material selection and integration is an essential facet of printed wiring board fabrication. Our expertise regarding advanced material types and combinations allows us to offer our customers a cost-effective solution for almost any design challenge. From high signal integrity to superior dimensional stability, trust Cirexx to make the optimal recommendation for every packaging challenge.
Isola
Copper-clad laminates & dielectric prepegs.
Arlon
High performance laminate and prepreg materials
ThinFlex
Polyimide flexible foil substrate.
Rogers
Step changes in wired & wireless communications circuits.
Taconic
Advanced engineered composite materials.
Sheldahl
Thin film deposition on flexible materials and more.
Panasonic
Optimum materials for next gen technologies.
Nelco
Superior thermal & mechanical performance.
Evonik
ROHACELL® HF – negligible absorption in the high frequency range
Hanwha
Hanwha Flexible Copper Clad Laminate, core in a flex circuit construction
Ventec
Professional Manufacturer in Copper Clad Laminates
Megtron
Low DK with better stability than PTFE’s
Ticer
Thin-film embedded resistor copper foil
Tatsuta
Thermal via fill
Ohmega
OhmegaPly Material for Buried resistors