Materials
Material selection and integration is an essential facet of printed wiring board fabrication. Our expertise regarding advanced material types and combinations allows us to offer our customers a cost-effective solution for almost any design challenge. From high signal integrity to superior dimensional stability, trust Cirexx to make the optimal recommendation for every packaging challenge.
Arlon
High performance laminate and prepreg materials
Evonik
ROHACELL® HF – negligible absorption in the high frequency range
Hanwha
Hanwha Flexible Copper Clad Laminate, core in a flex circuit construction
Isola
Copper-clad laminates & dielectric prepegs.
Megtron
Low DK with better stability than PTFE’s
Nelco
Superior thermal & mechanical performance.
Ohmega
OhmegaPly Material for Buried resistors
Panasonic
Optimum materials for next gen technologies.
Rogers
Step changes in wired & wireless communications circuits.
Sheldahl
Thin film deposition on flexible materials and more.
Taconic
Advanced engineered composite materials.
Tatsuta
Thermal via fill
ThinFlex
Polyimide flexible foil substrate.
Ticer
Thin-film embedded resistor copper foil
Ventec
Professional Manufacturer in Copper Clad Laminates
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