Sequential Lam & Stacked Vias

Stacked Vias
This technology is primarily used in the design and fabrication of HDI PCStacked vias. It’s used to connect very small diameter vias (via in-pad of surface vias to inner layers) in order to route fine pitch components.

Via in-pad micro vias play a key role in shrinking PCB size. These holes are not to be used for inserting a component lead or any other reinforcing material. However, the ability to place components either on or off the pads gives the designer greater flexibility to selectively create routing room in denser parts of the substrate.

Sequential Lamination of PCB layers is required in order to connect outer surface vias. This is due to the nature of the very small drill, and the aspect ratio requirement on all drills (example 10:1) down to the inner layer. This process is usually associated with via in-pad technology when routing fine-pitch, densely-routed designs.


Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Layout*, Fabrication, Assembly, Testing & Validation of high-reliability Flex, Rigid-Flex, RF/Microwave, HDI and Rigid Circuit Boards. Recognized as a time-technology leader, Cirexx offers a genuine Quick Turn service and provides a "one-stop-shop" and all in-house solution with 100% USA manufacturing. 

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* Cirexx Layout Services consist of Gerber File creation, including modeling and development of PWB mechanical features and signal performance, and the generation of associated engineering drawings for fabrication and/or manufacturing. These services can be certified to IPC or MIL specifications, but are not a part of the company’s ISO/AS Certification. © 2017 Cirexx International Inc. All Rights Reserved.