Placement of advanced fine pitch devices such as BGAs (ball grid arrays) and QFNs (quad flat no-lead) are also available. A BGA is a type of SMP (surface mount packaging – chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins in a smaller amount of space. The entire bottom surface of the device is used, instead of just perimeter edges. QFN packages are similar to BGAs as they physically and electrically connect integrated circuits to printed circuit boards. Leads are integrated into the perimeter edges of the device (all four) and “fold” under the device itself.
The assembly and soldering of BGA, QFN and other fine pitch devices requires precise process control and optimal methods for machine performance. Cirexx achieves this with top tier automated production equipment, state-of-the-art inspection (3D real-time x-ray), stridently developed & validated procedures, and of course, highly experienced engineers and operators.
To learn more about BGA or any other leading edge PCB assembly service from Cirexx, please fill out our Request for Quote form.