Materials for Electronics (MED) is a Division of Arlon LLC a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products). Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications. An exciting product is a lower loss version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest thermal expansion, highest phase stability, and lowest moisture absorption of any product in its class.
Legacy Thermount® Products
CLTE Product Family
TC Product Family
Next Generation of Lower Loss Materials, Available with PIM+ Technology
PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Unidirectional Plies
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Crossplied
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Non-Woven Reinforced PTFE
Ultra Thin Laminates with Higher Dielectric Constant
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
Reduced Passive Intermodulation (PIM) Laminates
Legacy, Low Cost Commercial Based Laminates
Thermoplastic Bonding Films for Stripline and Multilayer Packages
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Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Layout*, Fabrication, Assembly, Testing & Validation of high-reliability Flex, Rigid-Flex, RF/Microwave, HDI and Rigid Circuit Boards. Recognized as a time-technology leader, Cirexx offers a genuine Quick Turn service and provides a "one-stop-shop" and all in-house solution with 100% USA manufacturing.