Materials for Electronics (MED) is a Division of Arlon LLC a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products). Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications. An exciting product is a lower loss version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest thermal expansion, highest phase stability, and lowest moisture absorption of any product in its class.
Electronic Substrates
Polyimide Products
33N Kerimid 701 (VO) Polyimide
35N Kerimid 701 (V1) Polyimide
85N Polyimide - Unmodified
84N Multifilm Hole-Fill Prepreg
38N Low Flow Polyimide Prepreg
37N Low-Flow vs. No-Flow Polyimide
HF-50 Polymide Hole Fill Compound
Epoxy Products
44N "Multifilm" Hole-Fill Prepreg
45N Multifunctional Epoxy
47N Low-Flow Tetrafunctional Epoxy
49N Low-Flow Multifunctional Prepreg
51N Low-Flow Lead-Free
Legacy Thermount® Products
55NT Multifunctional Epoxy/Thermount®
85NT Polyimide/Thermount®
55LM Low Moisture Regain Thermount®
55ST Multifunctional Epoxy/Thermount®
Microwave Products
CLTE Product Family
CLTE-XT
CLTE-AT
CLTE
TC Product Family
TC350
TC600
Next Generation of Lower Loss Materials, Available with PIM+ Technology
AD255A
AD260A
AD300A
AD320A
PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
AD350A
AD410
AD430
AD450
AD1000
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Unidirectional Plies
DiClad 522
DiClad 527
DiClad 870
DiClad 880
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Crossplied
CuClad 250GT
CuClad 250GX
CuClad 233LX
CuClad 217LX
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Non-Woven Reinforced PTFE
IsoClad 917
IsoClad 933
Ultra Thin Laminates with Higher Dielectric Constant
AD5
AD10
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
25N
25FR
Reduced Passive Intermodulation (PIM) Laminates
DiClad 880-PIM
AD Series PIM
Legacy, Low Cost Commercial Based Laminates
CLTE-LC
AD250
AD255
AD270
AD320
AD350
AD600
AR1000
Thermoplastic Bonding Films for Stripline and Multilayer Packages
Materials for Electronics (MED) is a Division of Arlon LLC a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products). Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications. An exciting product is a lower loss version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest thermal expansion, highest phase stability, and lowest moisture absorption of any product in its class.