Arlon
Materials for Electronics (MED) is a Division of Arlon LLC a major manufacturer of specialty high performance laminate and prepreg materials for use in a wide variety of PCB (printed circuit board) applications. These applications typically require laminates with specialized electrical, thermal, mechanical, or other performance characteristic that exceed those of traditional standard FR-4 materials. Arlon Electronic Substrates specializes in thermoset resin technology including polyimide, high Tg multifunctional epoxy, and low loss thermoset laminate and prepreg systems. These resin systems are available on a variety of substrates including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCB’s (i.e. in mobile communication products). Arlon Microwave Materials specializes in fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, and low loss ceramic hydrocarbon thermoset laminates that deliver the electrical performance needed in frequency-dependent circuit applications such as base station antennas, phased array radars, power amplifier boards, communications systems, and various other antenna applications. An exciting product is a lower loss version of CLTE, called CLTE-XT. CLTE-XT has the lowest loss, lowest thermal expansion, highest phase stability, and lowest moisture absorption of any product in its class.
Electronic Substrates
Polyimide Products
| 33N Kerimid 701 (VO) Polyimide |  | 35N Kerimid 701 (V1) Polyimide | |
| 85N Polyimide - Unmodified | | 84N Multifilm Hole-Fill Prepreg | |
| 38N Low Flow Polyimide Prepreg | | 37N Low-Flow vs. No-Flow Polyimide | |
| HF-50 Polymide Hole Fill Compound | | | |
Epoxy Products
| 44N "Multifilm" Hole-Fill Prepreg | | 45N Multifunctional Epoxy | |
| 47N Low-Flow Tetrafunctional Epoxy | | 49N Low-Flow Multifunctional Prepreg | |
| 51N Low-Flow Lead-Free | | | |
Legacy Thermount® Products
| 55NT Multifunctional Epoxy/Thermount® | | 85NT Polyimide/Thermount® | |
| 55LM Low Moisture Regain Thermount® | | 55ST Multifunctional Epoxy/Thermount® | |
Microwave Products
CLTE Product Family
TC Product Family
| TC350 | | TC600 | |
Next Generation of Lower Loss Materials, Available with PIM+ Technology
PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
| AD350A | | AD410 | |
| AD430 | | AD450 | |
| AD1000 | | | |
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Unidirectional Plies
| DiClad 522 | | DiClad 527 | |
| DiClad 870 | | DiClad 880 | |
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Crossplied
| CuClad 250GT | | CuClad 250GX | |
| CuClad 233LX | | CuClad 217LX | |
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Non-Woven Reinforced PTFE
| IsoClad 917 | | IsoClad 933 | |
Ultra Thin Laminates with Higher Dielectric Constant
| AD5 | | AD10 | |
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
| 25N | | 25FR | |
Reduced Passive Intermodulation (PIM) Laminates
| DiClad 880-PIM | | AD Series PIM | |
Legacy, Low Cost Commercial Based Laminates
| CLTE-LC | | AD250 | |
| AD255 | | AD270 | |
| AD320 | | AD350 | |
| AD600 | | AR1000 | |
Thermoplastic Bonding Films for Stripline and Multilayer Packages
| CuClad 6250 | | CuClad 6700 | |
| CLTE-P | | | |
