Buried Resistance

Buried resistance is a thin film electrodeposited on copper NiP metal alloy (resistor conductor material). The alloy is laminated to a dielectric and subtractively processed to produce planar resistors. Due to the thin film nature, it can be buried within layers – without increasing the thickness of the board or occupying surface space (like discrete resistors).

• Improves line impedance matching.
• Reduces signal paths & series inductance.
• Reduces cross talk, noise and EMI.
• Enhances performance of cost-effective resistor technology in high speed high density circuit layout.
• Eliminates discrete resistors.
• Lead free compatible.
• Stable through a wide frequency range 20+Ghz.