Buried Resistance

Close-up of a printed circuit board with Buried Resistance.
Buried resistance is a thin film electrodeposited on copper NiP metal alloy (resistor conductor material). The alloy is laminated to a dielectric and subtractively processed to produce planar resistors. Due to the thin film nature, it can be buried within layers – without increasing the thickness of the board or occupying surface space (like discrete resistors).

  • Improves line impedance matching.
  • Reduces signal paths & series inductance.
  • Reduces cross talk, noise and EMI.
  • Enhances performance of cost-effective resistor technology in high speed high density circuit design.
  • Eliminates discrete resistors.
  • Lead free compatible.
  • Stable through a wide frequency range 20+Ghz.

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