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Arlon Materials For Electronics Division specializes in Microwave Materials and Substrates. Arlon materials are developed for the fabrication of high performance and frequency dependent printed circuit boards. |
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These materials can be used in many applications, from wireless communications to semiconductor test and measurement equipment.
We can use almost any Arlon Materials for any of your PCB Fabrication. |
Electronic Substrates
Polyimide Products
Epoxy Products
Legacy Thermount® Products
Specialty Foils
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Electrodeposited, High Temperature Elongatsion, Copper Foil
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- Double Treat and Drum Side Treated Copper Foil
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- 5 & 9 Micon Copper Foil (Fine Line Designs)
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- Ohmega-Ply® Resistive Clad Copper Foil (Etched Planar Resistors)
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Microwave Products
CLTE PRODUCT FAMILY (Highest degree of Performance)
TC PRODUCT FAMILY (Thermally Conductive, Temperature Phase Stable)
Next Generation of Lower Loss Materials, Available with PIM+ Technology
PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
Traditional Products - High PTFE to Glass Ratio, Lowest Loss Woven Fiberglass Reinforced PTFE - Unidirectional Plies
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Woven Fiberglass Reinforced PTFE - Crossplied
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Non-Woven Reinforced PTFE
Ultra Thin Laminates with Higher Dielectric Constant
Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
Reduced Passive Intermodulation (PIM) Laminates
Legacy, Low Cost Commercial Based Laminates
Thermoplastic Bonding Films for Stripline and Multilayer Packages
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