Products
|
Rigid FR-4 / 408 / RoHS
|
Flex & Rigid-Flex
|
Specialty Products
|
|
1 Day Turn Available
|
3 Day Turn Available
|
2 Day Turn Available
|
|
Std Lead Time - 10 Days
|
Std Lead Time - 15 Days
|
Std Lead Time - 10 Day
|
|
3 / 3 Design
|
1 - 22 Layers
|
RF / Hybrid
|
|
1-30 Layers
|
Silver Ink
|
Conductive Via Fill
|
|
High Frequency
|
Pic
|
Sequential LAM
|
|
Vias Down To 4 mil
|
Bookbinding
|
Blind / Buried Vias
|
|
Blind Vias / Stacked Vias
|
Adhesiveless
|
Rogers / Arlon / Taconic
|
|
Controlled Impedance
|
Controlled Impedance
|
Controlled Impedance
|
|
MIL-SPEC 31032
|
MIL-SPEC 31032
|
IPC
|
| Up To 22 Layers |
Up To 16 Layers |
|
|
Standard Lead Times
| Standard Rigid: 10 Days |
| Flex + Rigid-Flex: 15 Days |
| 24 hr Turnaround Available |
|
Capabilities
Design & Test:
| 2 mil Trace Width |
| 3 mil Air Gap |
| IPC Class 2 / IPC Class 3 |
| Flying Probe Net List Test |
|
 |
| Differential Impedance |
| TDR Testing |
| Automatic Optical Inspection |
|
|
Lamination:
| 1 to 30 Layers |
| Vacuum Lamination |
| Sequential Lamination |
|
Drill & Rout:
| Counter Sinks / Counter Bores |
| Scoring / Rout & Retain |
| Laser Route |
|
|
| Blind Vias / Buried Vias |
| Stacked Vias |
|
Plating:
| Conductive Via Fill |
| Non-Conductive Via Fill |
| Plated Edges |
| Plated Radii (Castellation) |
| Plated Milling Cutouts |
| Hard Gold Body / Soft Bondable Gold |
|
|
| Immersion Gold |
| HAL Lead Free (ROHS) |
| HAL Standard |
| Immersion Silver |
| Entek (OSP) |
|
Materials:
| Flex and Rigid Flex |
| KaptonTM & Non KaptonTM |
| RF and High Speed Materials |
| Mix Materials / FR-4-Teflon |
| Metal Back Boards (LED/Power Distribution) |
| Heavy Cu 6 oz Finish Rigid and Rigid / Flex |
|
Tolerances
Design & Test:
| Trace Tolerance |
+/- .0008" |
| Internal Drill To Cµ |
.007" |
| Pad Over FHS |
.004" |
| Soldermask Clearance Over PAD Size |
.005" |
| From Cµ To The Edge Of The Board |
.010" |
| Impedance |
+/- 10% |
Lamination:
| Board Thickness |
+/- 8% |
| Layer To Layer Registration +/- |
.005" |
Drill & Route:
| Route |
+/- .005" |
| Inside Radius |
.015" |
| Min. Slot Width |
.0021" |
| Drill Positioning |
.002" |
| From Cµ To The Edge Of The Board |
.010" |
| Impedance |
+/- 10% |
|
