Dupont HT

Cirexx is a leader in design and fabrication of HIGH TEMPERATURE APPLICATION FLEX CIRCUITS for use in industries such as Oil & Gas Exploration (“down hole”), Medical Instrument Sterilization (“autoclave survivability”); Engine Controls (“under hood”) and Automotive Brakes and Transmissions as well as many defense (aircraft, missile and vehicles) and space exploration applications.

Cirexx employs methodically developed process techniques along with DuPont’s new HT materials – copper clad laminate, coverlay and bondply – to fabricate state-of-the-art Flex Circuits which can operate at temperatures in excess of 250°C. The DuPont all-polyimide Pyralux HT material system have the highest temperature operating rating of any flex circuit material and provided with the long-standing quality and consistency that the industry has come value and expect from DuPont.

This proven interconnect solution gives the designer more options in solving electronic packaging challenges. With the ability to incorporate Flex Circuit and enjoy – in a high heat environment – the benefits of these three dimensional internconnects. Contact Cirexx for immediate discussion with an engineer to determine if this technology is right for your application.

“HT”, “Pyralux” and DuPont” are trademarks or registered trademarks of E. I. du Pont de Nemours and Company or its affiliates.

 

Dupont HT Datasheet

Dupont HT
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Copper Clad Laminants

Pyralux® AC copper-clad laminate
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Pyralux® AP copper-clad laminate
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Pyralux® AP-PLUS all-polyimide thick copper-clad laminate
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Pyralux® APR copper-clad resistor laminate
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Pyralux® LF Copper-clad Laminate
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Pyralux® FR copper-clad Laminate
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Pyralux® TK flexible circuit material
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Coverlay, Bondply & Sheet Adhesive

Pyralux® FR coverlay
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Pyralux® FR bondply
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Pyralux® FR sheet adhesive
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Pyralux® LF coverlay
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Pyralux® LF bondply
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Pyralux® LF adhesive
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Pyralux® LG Glass Reinforced Bonding Film
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Pyralux® PC Photoimageable Coverlay
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